lamination film is protection film as protection film LCD film adhesive film mulching film flexible film hologram film
My company produces the FPC materials,
1.Copper film
2.Cover film
3.PI Stiffener film
Halogen-free Cover film
1-The product is served as a complementary product for flexible copper clad laminate
3-Laptop Battery Protective Film is functions include Surface protection and heat insulation
3-Protection of copper foil is not exposed to the air, to avoid the oxidation of copper foil;
| Test Item | Unit | CWB015 | CWB125 | Test Method | ||
| Peel strength(90°) | kgf/cm | >1.0 | >1.2 | IPC-TM-650 2.4.9 | ||
| Dimensional Stability | MD/TD | % | ±0.15 | ±0.15 | IPC-TM-650 2.2.4 | |
| Chemical resistance (Dipping/10min) |
IPA/NaOH /HCI |
% | <6 | <6 | IPC-TM-650 2.3.2 | |
| Modulus | GPa | >1.6 | >1.6 | IPC-TM-650 2.4.18 | ||
| L | % | >90 | >90 | ASTM E313 | ||
| Reflectivity | % | >80 | >80 | JIS Z8722 | ||
| Solder | / | 300℃*10S | IPC-TM-650 2.4.13 | |||
| Adhesive Flow | mm | 0.05～0.125 | IPC-TM-650 2.3.17.1 | |||
| Volume resistivity | 1000V | Ω-cm | >1.0x1013 | IPC-TM-650 2.5.17 | ||
| Surface resistance | Ω | >1.0x1012 | ||||
| Dielectric Constant | 1MHz | / | 3.5～4.5 | IPC-TM-650 2.5.5.3 | ||
| Dissipation Factor | / | 0.040～0.050 | ||||
| glass-transition temperature |
AD | 1MHz | ℃ | 40～60 | DMA | |
| Flammability | / | V-0 | UL94 | |||
| Storage | Vacuumed packaging;Relative Temperature:<10℃;Humidity:<70RH%; Storage period:3months |
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The following is picture of the product 
My company produces the following materials, Need to contact us,
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