ED Copper Foils 12um 18um 25um 35um for FPC Materials & EMI
>. the treatment low profile foil in back/red.
>. Thickness: 12~35µm
>. Width: 200-1340mm
>. Performances:The product surface is black or red, has lower surface roughness.
>. Applications: Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film. Table1- Performance:
Typical properties of Low Profile Copper Foil
| Classification | Unit | Requirement | Test Method | ||||||
| Nominal thickness | / | 12um | 1/2 OZ(18um) | 3/4 OZ(25um) | 1 OZ(35um) | 50UM | 70UM | 105UM | IPC-4562A |
| Area Weight | g/㎡ | 107±4 | 153±5 | 228±8 | 285±10 | 435±15 | 585±20 | 870±30 | IPC-TM-650 2.2.12.2 |
| Purity | ％ | ≥99.8 | IPC-TM-650 2.3.15 | ||||||
| Roughness | Shiny side(Ra) | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | ≤0.43 | IPC-TM-650 2.3.17 |
| Matte side(Rz) | um | ≤4.5 | ≤5.0 | ≤6.0 | ≤7.0 | ≤8.0 | ≤12 | ≤14 | |
| Tensile Strength | R.T.(23℃) | ≥207 | ≥207 | ≥207 | ≥276 | ≥276 | ≥276 | ≥276 | IPC-TM-650. 2.4.18 |
| H.T.(180℃) | Mpa | ≥138 | |||||||
| Elongation | R.T.(23℃) | ≥4 | ≥4 | ≥5 | ≥8 | ≥10 | ≥12 | ≥12 | IPC-TM-650. 2.3.18 |
| H.T.(180℃) | ％ | ≥4 | ≥4 | ≥5 | ≥6 | ≥8 | ≥8 | ≥8 | |
| Peel Strength(FR-4) | N/mm | 0.8 | ≥1.0 | ≥1.1 | ≥1.2 | ≥1.4 | ≥2.0 | ≥2.0 | IPC-TM-650 2.4.8 |
| Ibs/in | 4 | ≥4.6 | ≥5.7 | ≥6.3 | ≥7 | ≥8 | ≥11.4 | ≥11.4 | |
| Pinholes&porosity | Number | No | IPC-TM-650 2.1.2 | ||||||
| Anti-oxidization | R.T.(23℃) | 180 | |||||||
| H.T.(200℃) | 60 Minutes | 30 | |||||||
Low Profile Copper Foil Picture
