This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.
| Classification | Unit | Requirement | Test Method | |||||||
| Nominal thickness | um | 12 | 18 | 25 | 35 | 50 | 70 | 105 | IPC-4562A | |
| Area Weight | g/m² | 107±5 | 153±7 | 225±8 | 285± 10 | 435±15 | 585± 20 | 870±30 | IPC-TM-650 2.2.12.2 | |
| Purity | % | ≥99.8 | IPC-TM-650 2.3.15 | |||||||
| Roughness | Shiny side (Ra) | սm | ≤0.43 | IPC-TM-650 2.3.17 | ||||||
| Matte side(Rz) | um | ≤4.5 | ≤5.0 | ≤6.0 | ≤7.0 | ≤8.0 | ≤12 | ≤14 | ||
| Tensile Strength | R.T.(23°C) | Mpa | ≥207 | ≥276 | IPC-TM-650 2.4.18 | |||||
| H.T.(180°C) | ≥138 | |||||||||
| Elongation | R.T.(23°C) | % | ≥4 | ≥4 | ≥5 | ≥8 | ≥10 | ≥12 | ≥12 | IPC-TM-650 2.4.18 |
| H.T.(180°C | ≥4 | ≥4 | ≥5 | ≥6 | ≥8 | ≥8 | ≥8 | |||
| Resistivity | Ω.g/m² | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | ≤0.162 | IPC-TM-650 2.5.14 | |||
| Peel Strength(FR-4) | N/mm | ≥1.0 | ≥1.3 | ≥1.6 | ≥1.6 | ≥2.1 | IPC-TM-650 2.4.8 | |||
| Pinholes & Porosity | Number | / | / | No | IPC-TM-650 2.1.2 | |||||
| Anti-oxidization | R.T.(23°C) | Days | / | / | 180 | / | ||||
| H.T.(200°C) | Minutes | / | / | 30 | / | |||||
Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.
