More Detail
1. Material : Cu-ETP (110) ,Cu-ETP(110),C11000,C1100 CU-ETP,T2,CW004A
2. Temper : Hard or Half Hard ; SOFT(R220)/Annealed ; 1/2-hard (R240 ); Hard
3. Core ID: 76MM,152MM 500ML
4. Max. roll weight : 1500kgs/roll
5. Max. width can supply 1400mm
5, Trial sample min.quantity :100kgs
6. Use more width : 914mm,1000mm, 1250mm,1320mm ,1400mm
1. For faradays cages
2. For RF MRI shieding / RFI/EMI chembers/builds MRI rooms (RF shielded rooms)
| DIN-EN | CEN | ASTM | Application Area |
| Cu-ETP | CW004A | C11000 | Basic materials for electronic components |
| CuZn30 | CW505L | C26000 | Basic materials of electronic components and installation parts in the electronic industry, with the increase of Zn content, the corresponding metal cost decreases. |
| CuZn33 | CW506L | C26800 | |
| CuZn36 | CW507L | C27000 | |
| CuZn37 | CW508L | C27200 | |
| CuSn4 | CW450K | C51100 | Contact springs, connectors, reeds, switching parts, fixed contacts, ultra-high strength elastic elements. |
| CuSn5 | CW451K | C51000 | |
| CuSn6 | CW452K | C51910 | |
| CuSn8 | CW453K | C52100 | |
| CuB3S | C70250 | Connectors, benders, relays | |
|
CuSn3Zn9 CuSn2Zn10 |
CWK454K | C42500 |
In terms of alloy properties and low metal cost performance, Comprehensive Cost Performance Ratio is the best. Assessment Value of Waste Recycling is excellent. |
Chemical composition
| Page | Alloy |
Cu (%) |
O (%) |
P (%) |
Zn (%) |
Ni (%) |
Sn (%) |
Fe (%) |
Mn (%) |
Si (%) |
Mg (%) |
Zr (%) |
Other (%) |
| 3.4 | Cu-ETP-C11000 | 99.9 | ≤0.040 | ||||||||||
| 3.50 | CuZn30-C26000 | 69-71 | Remain | Max0.3 | Max0.1 | Max0.05 | |||||||
| 3.6 | CuZn33-C26800 | 66-68 | Remain | Max0.3 | Max0.1 | Max0.05 | |||||||
| 3.7 | CuZn36-C27000 | 63.5-65.5 | Remain | Max0.3 | Max0.1 | Max0.05 | |||||||
| 3.8 | CuZn37-C27200 | 62-64 | Max0.3 | Max0.1 | Max0.10 | ||||||||
| 3.9 | CuSn4-C51100 | Remain | 0.01-0.4 | 3.5-4.5 | |||||||||
| 3.10 | CuSn5-C51000 | Remain | 0.01-0.4 | 4.5-5.5 | |||||||||
| 3.10 | CuSn5-C51000 | Remain | 0.01-0.4 | 4.5-5.5 | |||||||||
| 3.11 | CuSn6-C51900 | Remain | 0.01-0.4 | 5.5-7.0 | |||||||||
| 3.12 | CuSn8-C52100 | Remain | 0.01-0.4 | 7.5-8.5 | |||||||||
| 3.13 | C70250-CuNi3Si | Min96.2 | 2.2-4.2 | 0.25-1.2 | 0.05-0.30 | Remain | |||||||
| 3.14 |
CuSn3Zn9/ CuSn2Zn10-C42500 |
87-90 | Remain | 1.5-3.0 |
Mechanical /Physical Properties
| Page | Alloy* | Density** |
Coefficient of Thermal Expansion** |
Heat Conductivity* |
Conductivity***
|
Conductivity *** |
|
| g/cmm³ | 10*-3 |
Watts/(M· Kelvin) |
Siemens/M | IACS/% | Gigabit Pa | ||
| 3.4 | Cu-ETP-C11000 | 8.9 | 17.7 | 394 | 58 | 100 | 127 |
| 3.50 | CuZn30-C26000 | 8.5 | 19.7 | 126 | 14.5 | 25 | 115 |
| 3.6 | CuZn33-C26800 | 8.5 | 19.9 | 121 | 14.5 | 25 | 112 |
| 3.7 | CuZn36-C27000 | 8.45 | 20.2 | 121 | 24 | 110 | |
| 3.8 | CuZn37-C27200 | 8.45 | 20.2 | 121 | 14 | 24 | 110 |
| 3.9 | CuSn4-C51100 | 8.85 | 17.8 | 100 | 11 | 19 | 120 |
| 3.10 | CuSn5-C51000 | 8.85 | 17.8 | 90 | 9 | 15 | 120 |
| 3.11 | CuSn6-C51900 | 8.8 | 18.5 | 75 | 8 | 13 | 118 |
| 3.12 | CuSn8-C52100 | 8.8 | 18.5 | 67 | 6.5 | 11 | 115 |
| 3.13 | C70250-CuNi3Si | 8.8 | 17.6 | 190 | 23 | 40 | 130 |
| 3.14 |
CuSn3Zn9/ CuSn2Zn10-C42500 |
8.8 | 18.4 | 120 | 16 | 25 | 126 |
Circuitturns the path, because of excellent electrical conductivity of copper
Certification: SGS, ISO,Reach, RoHS
