LP Low Profile ED Copper Foil 18um 35um For Mobile Phone
Matte side treatment low profile foil in back/red.
Features:
1. the treated foil in gray or red
2. High profile with properties of LP-S-B/R suitable for FCCL
3. Grain structure of copper foil leads to high flexibility
4. Excellent etching performance
5. low profile enables to make fine circuit pattern
Application:
1. Casting and lamination type FCCL
2. Super fine pattern FPC
3. Chip on flex (COF) for LED
Typical properties of LP-S-B/R ED electrolytic copper foil(for FPC or inner layer of HDI)
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Classification
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Unit | Requirement | Test Method | |||||||
| Foil Designation | / | 1 | H | M | 1 | IPC-4562A | ||||
| Nominal thickness | / | 10um | 12um | 1/2 OZ(18um) | 3/4 OZ(25um) | 1 OZ(35um) | IPC-4562A | |||
| Area Weight | g/㎡ | 98±4 | 107±4 | 153±5 | 228±8 | 285±10 |
IPC-TM-650 2.2.12.2 |
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| Purity | ％ | ≥99.8 |
IPC-TM-650 2.3.15 |
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| Foil Profile | Shiny side(Ra) | սm | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 |
IPC-TM-650 2.3.17 |
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| Matte side(Rz) | um | ≤4.0 | ≤4.5 | ≤5.5 | ≤6.0 | ≤8.0 | ||||
| Tensile Strength | R.T.(23℃) | Mpa | ≥260 | ≥260 | ≥280 | ≥280 | ≥280 |
IPC-TM-650 2.3.18 |
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| H.T.(180℃) | Mpa | ≥180 | ≥180 | ≥180 | ≥180 | ≥180 | ||||
| Elongation | R.T.(23℃) | ％ | ≥5 | ≥6 | ≥8 | ≥10 | ≥12 |
IPC-TM-650 2.3.18 |
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| H.T.(180℃) | ％ | ≥5 | ≥6 | ≥7 | ≥8 | ≥8 | ||||
| Peel Strength(FR-4) | N/mm | 0.7 | 0.8 | 1.0 | 1.1 | 1.2 |
IPC-TM-650 2.4.8 |
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| Ibs/in | 4 | 4.6 | 5.7 | 6.3 | 6.9 | |||||
| Pinholes&porosity | Number | No |
IPC-TM-650 2.1.2 |
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| Anti-oxidization | R.T.(23℃) | 180days | / | |||||||
| H.T.(200℃) | 60 Minutes | / | ||||||||
1.Standard Width 520mm,max width 1295(±1)mm,May according to the customer request tailor.
We test the peel strength with PI ,please reconfirm with your pp.
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