Low Profile Copper Foil 50um 70um 90um With Red Color For Samsung Phone Heat Sink
Application
LP Flexible copper foil
For Super fine pattern FPC.
And multilayer circuit boards.
Samsung Phone Heat Sink
Flexible circuit board
Heat Sink tape for Mobilephone
Specification reference.
Standard Width 1290mm,max width 1380(±1)mm,May according to the customer reque.
Thickness Range: 0.012~0.070 mm.
ID: 76 mm,152 mm.
Packaing:
wooden box
Different between CA copper foil and ED copper foil.
1. Process: rolled copper foil (Rolling process),ED copper foil (Electrodeposition process).
2. Strength toughness: rolled copper foil is a flaky crystalline structure, so the strength and toughness is better than electrolytic copper foil, so most of the rolling copper foil used in flexible printed circuit boards.
LP/low profile copper foil of Properties.
|
Classification
|
Unit | Requirement | Test Method | |||||
| Foil Designation | / | 1 | H | M | 1 | IPC-4562A | ||
| Nominal thickness | / | 10um | 12um | 1/2 OZ(18um) | 3/4 OZ(25um) | 1 OZ(35um) | IPC-4562A | |
| Area Weight | g/㎡ | 98±4 | 107±4 | 153±5 | 228±8 | 285±10 |
IPC-TM-650 2.2.12.2 |
|
| Purity | ％ | ≥99.8 |
IPC-TM-650 2.3.15 |
|||||
| Foil Profile | Shiny side(Ra) | սm | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 |
IPC-TM-650 2.3.17 |
| Matte side(Rz) | um | ≤4.0 | ≤4.5 | ≤5.5 | ≤6.0 | ≤8.0 | ||
| Tensile Strength | R.T.(23℃) | Mpa | ≥260 | ≥260 | ≥280 | ≥280 | ≥280 |
IPC-TM-650 2.3.18 |
| H.T.(180℃) | Mpa | ≥180 | ≥180 | ≥180 | ≥180 | ≥180 | ||
| Elongation | R.T.(23℃) | ％ | ≥5 | ≥6 | ≥8 | ≥10 | ≥12 |
IPC-TM-650 2.3.18 |
| H.T.(180℃) | ％ | ≥5 | ≥6 | ≥7 | ≥8 | ≥8 | ||
| Peel Strength(FR-4) | N/mm | 0.7 | 0.8 | 1.0 | 1.1 | 1.2 |
IPC-TM-650 2.4.8 |
|
| Ibs/in | 4 | 4.6 | 5.7 | 6.3 | 6.9 | |||
| Pinholes&porosity | Number | No |
IPC-TM-650 2.1.2 |
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| Anti-oxidization | R.T.(23℃) | 180days | / | |||||
| H.T.(200℃) | 60 Minutes | / | ||||||
