Use of LP Copper Foil.
Flexible Copper Clad Laminate with Casting and lamination type,Super fine pattern FPC,Chip on flex (COF) for LED,multilayer circuit boards.
Difference between rolled copper foil and electrolytic copper foil.
Performance is different ,Strength toughness: Rolled copper foil is a flaky crystalline structure, so the strength and toughness is better than electrolytic copper foil, so most of the rolling copper foil used in flexible printed circuit boards.Width different:: rolling copper foil width ≤ 620mm, electrolytic copper foil width ≤ 1380mm.
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Classification |
Unit | Requirement | Test Method | |||||
| Foil Designation | / | 1 | H | M | 1 | IPC-4562A | ||
| Nominal thickness | / | 10um | 12um | 1/2 OZ(18um) | 3/4 OZ(25um) | 1 OZ(35um) | IPC-4562A | |
| Area Weight | g/㎡ | 98±4 | 107±4 | 153±5 | 228±8 | 285±10 |
IPC-TM-650 2.2.12.2 |
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| Purity | ％ | ≥99.8 |
IPC-TM-650 2.3.15 |
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| Foil Profile | Shiny side(Ra) | սm | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 | ≤2.5 |
IPC-TM-650 2.3.17 |
| Matte side(Rz) | um | ≤4.0 | ≤4.5 | ≤5.5 | ≤6.0 | ≤8.0 | ||
| Tensile Strength | R.T.(23℃) | Mpa | ≥260 | ≥260 | ≥280 | ≥280 | ≥280 |
IPC-TM-650 2.3.18 |
| H.T.(180℃) | Mpa | ≥180 | ≥180 | ≥180 | ≥180 | ≥180 | ||
| Elongation | R.T.(23℃) | ％ | ≥5 | ≥6 | ≥8 | ≥10 | ≥12 |
IPC-TM-650 2.3.18 |
| H.T.(180℃) | ％ | ≥5 | ≥6 | ≥7 | ≥8 | ≥8 | ||
| Peel Strength(FR-4) | N/mm | 0.7 | 0.8 | 1.0 | 1.1 | 1.2 |
IPC-TM-650 2.4.8 |
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| Ibs/in | 4 | 4.6 | 5.7 | 6.3 | 6.9 | |||
| Pinholes&porosity | Number | No |
IPC-TM-650 2.1.2 |
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| Anti-oxidization | R.T.(23℃) | 180days | / | |||||
| H.T.(200℃) | 60 Minutes | / | ||||||
Standard Width 1290mm,max width 1380(±1)mm,May according to the customer request.
