Product Description
35um 1oz Electrolytic copper foil with high temperature electrolytic copper foil for MCCL CCL
Features:
1. The treated foil in gray or red
2. High peel strength
3. Good etch ability
4. Excellent adhesion to etching resist
5. Anti foil cracking by high elongation at elevated temperature
6. Eco-friendly products and processes
Application:
1. PCB board
3. Antennas pcb
4. Polyimide board
5. Epoxy board
6. CCL
7. MCCL,Metal Copper Clad Laminate
Typical properties of High temperature elongation copper foil specification
| Thickness | um | 12 | 18 | 35 | 70 |
IPC-TM-650 2.3.12 |
|
| Area weight | g/m² | 107±10 | 153±15 | 305±30 | 610±61 |
IPC-TM-650 2.2.12 |
|
| Roughness | (RA) | μm | <0.43 | <0.43 | <0.43 | <0.43 |
IPC-TM-650 2.2.17 |
| (RZ) | μm | <7 | <8.0 | <10.0 | <14 | ||
|
Copper≥ |
% | Above99.8 |
IPC 4562 2.3.15 |
||||
| Tensile Strength | State normal | kg/mm2 | >21 | >21 | >28 | >28 |
IPC 4562 2.4.18 |
| State temper (180℃) | >15 | >15 | >15 | >15 | |||
| ElongationI | state normal | % | >3.0 | >4 | >5 | >5 |
IPC 4562 2.4.18 |
| state temper (180℃) | % | >2 | >2 | >3 | >3 | ||
| Peel strength | kg/cm | >1.1 | >1.3 | >1.7 | >1.9 |
IPC 4562 2.4.8
|
|
|
High temperature oxidation resistance(225℃, 10min) |
No color change | CCP Standard | |||||
| Solderability | Good | CCP Standard | |||||
| Splice | ≤2 | CCP Standard | |||||
Remark:
1.Standard Width,1295(±1)mm,max width is 1380mm,May according to the customer request tailor.
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