18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing/High-Speed Copper Clad Laminates
JIMA Copper is doing copper foil of Li-ion battery 4.5um to 14um more than 12 years. and production capacity 150000tons /years.
Features:
1,Special silane treatment with high peel strength
2,Nanoscale treatment of copper nodules
3,Excellent anti-oxidation and shelf life
4,Enhanced Bonding Strength
5,Smooth Surface Finish,High Electrical Conductivity
6,Improved Flexibility,Resistance to Corrosion
7,Diverse Thickness and Width Options
8,It has better etching performance. It can effectively shorten the production process, achieve higher speed and fast micro-
etching, and improve the qualification rate of printed circuit boards.
Application:
1,High Density Interconect(HDI)
2,High speed digital
3,Production of high-frequency and high-speed copper clad laminates
4,Communication electronic equipment (Base station / Server routers, switches)
5,Computer hardware
6, PCB board manufacturing
7, Semiconductor industry
8, Electromagnetic shielding and heat conduction
9,Multilayer board；high-frequency board
Details Package: wooden box
FAQ:
Q1: delivery time ?
A: The general delivery time is 10~15 working days.
Q2: What's your minimum order quantity?
A: The MOQ is 10kg.
Q3. what is your standard width?
A: 300mm 500mm 600mm,we accept customization for the width. we can cut it into any size that you demand after pass discussing.
18μm RTF Reverse Copper Foil Series standard sample digital:
Specifications standard sample(35 μm)
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Mechanical Properties
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Ra on matte side Rz
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<2.5 μm
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Tensile strength
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>330 MPa
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Elongation
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>5%
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peel strength(FR4)
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≥1.5 N/mm(FR4)
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Project
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Unit
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Technical requiremente
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Thickness
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μm
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18
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35
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70
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Unit Area Weight
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g/m2
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145±5
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275±5
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585±5
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Roughness
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M side Rz
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μm
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≤3.5
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≤5.0
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≤8.0
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S side Rz
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μm
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≤3.0
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≤3.0
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≤3.0
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Tensile Strength
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25℃
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MPa
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≥320
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≥320
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≥320
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Elongation
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25℃
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%
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≥5
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≥8
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≥8
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Peel Strength
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N/mm
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1.2
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1.2
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1.2
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Antioxidant Capacity
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-
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200℃ 40min No oxidation
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Remark: accept customization, Standard Width,100-1440(±1)mm,
