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Electrolytic HTE Copper Foil For Printed Circuit Board 350kg Big Roll

100kg
MOQ
negotiation
Price
Electrolytic HTE Copper Foil For Printed Circuit Board 350kg Big Roll
Features Gallery Product Description Request A Quote
Features
Specifications
Purity: 99.95%
Anti Oxidation: 180 Degree 60 Minutes, 180 Days 23 Degree
Thickness: 1/2 Oz,3/4 Oz,1 Oz,2 Oz,
Color: Red Or Black
Elongation: ≥ 1.5%
Tensile Strength: ≥ 160 MPa
Peel Strength: ≥ 1 N/mm
Foil Profile: RA≤0.15μm,Rz≤1.7μm
Length Per Roll: 500 - 5000 Meter
Inter Diameter: 76 Mm,152 Mm, 3 Inch,6 Inch
Highlight:

electrodeposited copper foil

,

copper thin sheet

Basic Infomation
Place of Origin: China
Brand Name: JIMA
Certification: SGS, ISO,Reach, RoHS
Model Number: EDCU-HC
Payment & Shipping Terms
Packaging Details: wooden carton
Delivery Time: 5-15 days
Payment Terms: T/T, L/C
Supply Ability: 1000 Ton per month
Product Description

350kgs big roll  HTE ED electrolytic copper foil for printed circuit board PCB​ antenna PCB

 

Detail Specification:

Single side treatment in red.
Nominal Thickness: 0.012-0.070 mm
Width range: 5-1380mm,standard width:1290mm
Length range : 500-5000 M
Internal diameter: 3 inch/6 inch.
stype:matte

 

Classify:

 

(STD-E)- standard electrodeposited copper foil.

(HD-E)-high ductility electrodeposited copper foil.

(HTE-E)-high temperature elongation electrodeposited copper foil.

Electrolytic HTE Copper Foil For Printed Circuit Board 350kg Big Roll 0

Copper foil Applicatio

  PCB industry .
application PCB manufacture
  antenna PCB,Epoxy board
  Epoxy board

FAQ:

Q1: Can you customize the special size as per our requirement?

A:we can cut into as your request size.

Q16. How to save after the box opened?

A: Keep the dry environment,and is better use it in 30days.

Q4: Can you supply the sample?

A: We can supply A4 samples

 

HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).

Thickness um 9 12 18 25 35 70

IPC 4562

4.6.3.1

Area weight g/m² 80±1 107±3 153± 215±5 285±5 585±8

IPC 4562

4.6.3.2

Roughness (RA) μm 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4

IPC 4562

4.6.9

(RZ) μm <6.0 <6.5 <8.0 <9.0 ≤10.0 <15

 

Copper≧

% 99.8

IPC 4562

4.6.3.1

Tensile Strength state normal Mpa >300 >300 >300 >300 >300 >280

IPC 4562

4.6.4

state temper (180℃) Mpa >15.0 >18.0 >18.0 >18.0 >18.0 >18.0
ElongationI state normal % >3.0 >3.0 >5.0 >6.0 >10.0 >10.0

IPC 4562

3.5.3

state temper (180℃) % >2.0 >2.5 >2.5 >3.0 >5.0 >5.0
Peel strength N/mm >1.0 >1.05 >1.35 >1.70 >1.8 >2.0

IPC 4562

4.6.7

High temperature oxidation resistance(200℃,

40min)

No color change Standard
Solderability Good Standard
Solderability Good

IPC 4562

4.6.12

3. Standard Width,1295(±1)mm,May according to the customer request tailor.

We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp

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Contact Person : JIMA Annie
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