HTE Copper Foil 9um Copper Foil 28um Used For Samsung Phone PCB
Products Detail:
a. single side side treatment low profile foil in back/red.
b. Nominal Thickness: 9um,28um
c. Width: 5-1380mm,standard width:1290mm.
d. ID: 76 mm,152 mm.
e. Cu purity :99.8%.
f. Quality standard:IPC 4562.
Products use Application:
1. Polyimide board
2. Epoxy board
3. PCB and antenna PCB,FPC,Samsung Phone PCB
Description.
.Excellent adhesion to etching resist..
.Anti foil cracking by high elongation at elevated temperature.
.Eco-friendly products and processes.
HTE Copper Foil Technical Parameters Sheet
| Thickness | um | 9 | 12 | 18 | 25 | 35 | 70 |
IPC 4562 4.6.3.1
|
|
| Area weight | g/m² | 80±1 | 107±3 | 153± | 215±5 | 285±5 | 585±8 |
IPC 4562 4.6.3.2 |
|
| Roughness | (RA) | μm | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 |
IPC 4562 4.6.9 |
| (RZ) | μm | <6.0 | <6.5 | <8.0 | <9.0 | ≤10.0 | <15 | ||
|
Copper≧ |
% | 99.8 |
IPC 4562 4.6.3.1
|
||||||
| Tensile Strength | state normal | Mpa | >300 | >300 | >300 | >300 | >300 | >280 |
IPC 4562 4.6.4 |
| state temper (180℃) | Mpa | >15.0 | >18.0 | >18.0 | >18.0 | >18.0 | >18.0 | ||
| ElongationI | state normal | % | >3.0 | >3.0 | >5.0 | >6.0 | >10.0 | >10.0 |
IPC 4562 3.5.3 |
| state temper (180℃) | % | >2.0 | >2.5 | >2.5 | >3.0 | >5.0 | >5.0 | ||
| Peel strength | N/mm | >1.0 | >1.05 | >1.35 | >1.70 | >1.8 | >2.0 |
IPC 4562 4.6.7 |
|
|
High temperature oxidation resistance(200℃, 40min) |
No color change | Standard | |||||||
| Solderability | Good | Standard | |||||||
| Solderability | Good |
IPC 4562 4.6.12 |
|||||||
Standard Width,1295(±1)mm,May according to the customer request tailor.
Package& Equipment
FAQ:
Q1. Is it possible be zinc free copper foil?
Yes ,we can do it.
Q2. Can you provide COA?
Yes , we can.
Q3. Is it the Fumigation carton box?
Yes ,it is .
