Product Description
35micron High elongation electrolytic copper foil with high thermal endurance for MCCL Metal Copper Clad Laminate
Electrolytic copper foil of Features:
1. The treated foil in gray or red
2. High peel strength
3. Good etch ability
4. Excellent adhesion to etching resist
5. Anti foil cracking by high elongation at elevated temperature
6. Eco-friendly products and processes
7. High temperature elongation
8. High thermal endurance
Application for electrolytic copper foil
1. PCB board,pcb
3. Antennas pcb
4. Metal Copper Clad Laminate
5. MCCL
6. CCL
Electrolytic copper foil shows:
Mill Test Certificate of High temperature elongation ED copper foil
| Thickness | um | 12 | 18 | 35 | 70 |
IPC-TM-650 2.3.12 |
|
| Area weight | g/m² | 107±10 | 153±15 | 305±30 | 610±61 |
IPC-TM-650 2.2.12 |
|
| Roughness | (RA) | μm | <0.43 | <0.43 | <0.43 | <0.43 |
IPC-TM-650 2.2.17 |
| (RZ) | μm | <7 | <8.0 | <10.0 | <14 | ||
|
Copper≥ |
% | Above99.8 |
IPC 4562 2.3.15 |
||||
| Tensile Strength | State normal | kg/mm2 | >21 | >21 | >28 | >28 |
IPC 4562 2.4.18 |
| State temper (180℃) | >15 | >15 | >15 | >15 | |||
| ElongationI | state normal | % | >3.0 | >4 | >5 | >5 |
IPC 4562 2.4.18 |
| state temper (180℃) | % | >2 | >2 | >3 | >3 | ||
| Peel strength | kg/cm | >1.1 | >1.3 | >1.7 | >1.9 |
IPC 4562 2.4.8
|
|
|
High temperature oxidation resistance(225℃, 10min) |
No color change | CCP Standard | |||||
| Solderability | Good | CCP Standard | |||||
| Splice | ≤2 | CCP Standard | |||||
Remark:
1.Standard Width is1295(±1)mm,Max width is 1380mm,May according to the customer request tailor.
Package of electrolytic copper foil :
