Item | Soft Temper Rolled Copper Foil 18um 12um 9um 35um For Tape Used For Phone |
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Application | Conductive Tape And Phone |
Thickness | 6um 18um 12um 9um 35um 50um 70um |
Inter Diameter | 76 Mm,152 Mm,3 Inch,6 Inch,80mm |
Packaging Details | wooden carton |
Products Name | 105μm High Precision Ultra Wide Calendered Thick Copper Foils |
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Application | Power Modules, Energy Storage Inverters, Automotive Electronic Components (Electronic Controls, Electric Drives) Electronics Industry (Printed Circuit Boards (PCBs), Flat Panel Displays (FPDs), Semiconductor Packaging); Telecommunications Industry (Base St |
Sample | A4 Size Free |
Core ID | 76mm,152mm |
Lead Time | 10-15day |
Pinholes | None |
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Thickness | 100um,100micron,100 µ |
Elongation | Min.2% |
Inter Diameter | 76 Mm, 3 Inch, |
Products Name | Electrolytic Copper Foil Of 100 µ With Width Of The Foil 300 Mm For Using In Conductive Foil Solutions |
Name | 0.025mm Thick ED Copper Foil , Copper Foil 25 Micron |
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Purity | 99.9% |
Anti Oxidation | 180 Degree 60 Minutes, 180 Days 23 Degree |
Thickness | 25um,0.025mm |
Length Per Roll | 500 - 5000 Meter |
Name | 4.5um 6um Rolled Copper Foil For Lithium Battery Plain |
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Thickness | 6um 9um 12um 18um 35um 50um 70um |
Standard Width | 520mm,Max 630mm,can Be Cutting As Request |
Application | EV Battery, Lithium Battery, Lithium-ion Batteries, Electric Vehicles Li-ion Battery, Lithium Ion Battery |
ID | 76MM |
Application | FCCL,CCL |
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Thickness | 12um,12micron,0.012mm |
Standard | IPC-4562 / IPC9TM-650 |
Name | Ultra Thin Rolled Copper Foil , Under 0.025um Roughness Rolled Copper Foil |
Roughness | Under 0.025um |
Products Name | 35μm High-frequency Microwave Forward Copper Foil For High Frequency PCB |
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Application | (HDI) High Density Interconect HSD (High Speed Digital) Base Station / Server。 Communication Field (satellite Communication, 5G Communication, Radar System); Aerospace Field (avionics, Satellite Antenna); Medical Field (medical Equipment, Medical Imagin |
Sample | A4 Size Free |
Core ID | 76mm,152mm |
Lead Time | 10-15day |
Products Name | 18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing/High-Speed Copper Clad Laminates |
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Application | 1、High Density Interconect(HDI) 2、(High Speed Digital) 3、Production Of High-frequency And High-speed Copper Clad Laminates, 4、communication Electronic Equipment (Base Station / Server Routers, Switches), 5、computer Hardware, 6、 PCB Board Manufacturing, |
Sample | A4 Size Free |
Core ID | 76mm,152mm |
Lead Time | 10-15day |
Purity | Above 99.9% |
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Thickness | 4oz,140um,0.14mm |
Application | Shielding Room Construction |
Name | Electrolytic Copper Foil 4oz For RF/MRI/EMI Shielding Application |
Max Width | 1360mm,1290mm,1370mm 1380mm |
Purity | 99.95% |
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Anti Oxidation | 180 Degree 60 Minutes, 180 Days 23 Degree |
Color | Red Or Black |
Foil Profile | RA≤0.15μm,Rz≤1.7μm |
Application | FCCL,FPC |